We are a property development and management firm currently focusing on redeveloping two parcels of land in Gushu, Shenzhen, and Guangming, Shenzhen, respectively, by converting these two parcels of land into high-end commercial complexes. 


Land Development Projects

CMOS sensor modules, which we began manufacturing in June 2003, for integration into various image capturing devices such as digital cameras for cellular phones and home entertainment products.
Wireless Headsets for use with the cellular phones.
Digital audio broadcast modules are designed into digital radio products such as home tuners, kitchen radios, in-car receivers, PCI cards, CD players, clock radios, boom boxes, midi-systems and handheld portable devices.
Front light panels for handheld video game devices, which we began manufacturing in January 2003.


We utilize advanced technologies in the manufacturing of our products. To satisfy the needs of our OEM customers we stay abreast of advancements in technology, upgrading the technologies used in production to maximize flexibility in product design, increase quality levels, and minimize production costs.

CHIP ON FILM, OR COF, is an assembly method for bonding integrated circuit chips and other components onto a flexible printed circuit. This process allows for greater compression of the size of a product when assembled enabling the production and miniaturization of small form factor devices like cellular phones, PDAs, digital cameras and notebook PCs. As of December 31, 2007, we had 16 COF machines. These machines connect the bump of large scale integrated, or LSI, driver onto FPC pattern with anisotropic conductive film, or ACF. These COF machines have the ability to pitch fine to 38 micrometers and a total production capacity of up to 4,400,000 chips per month.

CHIP ON GLASS, OR COG, is a process that connects integrated circuits directly to LCD panels without the need for wire bonding. We apply this technology to produce advanced LCD modules for high-end electronic products, such as cellular phones and PDAs. As of December 31, 2007, we had 23 COG lines in our principal manufacturing facilities. These machines provide an LCD of dimension of up to 200 millimeters (length) x 150 (width) x 2.2 (height), a process time of five seconds per chip, a pin pitch fine to 38 micrometers and a total production capacity of up to 4,200,000 chips per month. During 2005, our subsidiary, Jetup, also started manufacturing COG LCD modules. As of December 31, 2007, Jetup had nine COG lines and is capable of bonding 5 million units of COG LCD modules a month. They are able to bond LCD panels up to sizes of 200 millimeters x 200 millimeters x 2.2 millimeters thick, with an accuracy of five microns’ tolerance, in a cycle time of 12-15 seconds per piece.

CHIP ON BOARD, OR COB, is a technology that utilizes wire bonding to connect large-scale integrated circuits directly to printed circuit boards. As of December 31, 2007, we had 53 COB aluminum bonding machines which provide a high speed chip bonding time of 0.25 second per 2 millimeters wire, a bond pad fine to 75 micrometers and a total production capacity of up to 3,829,000 (150 wires/board) per month. We use COB aluminum bonding in the assembly of consumer products such as digital pen, calculators, electronic dictionaries and audio products. We also had three COB gold ball bonding machines which provide a high speed chip bonding time of 0.072 second per 2 millimeters wire, a bond pad fine to 50 micrometers and a total production capacity of up to 500,000 (150 wires/board) per month. We use COB gold ball bonding in the CMOS camera module, which use in USB camera, notebook computer, mobile phone and digital pen.

OUTER LEAD BONDING, OR OLB, is an advanced technology used to connect PCBs and large-scale integrated circuits with a large number of connectors. We use this technology to manufacture complex miniaturized products, such as high-memory PDAs. As of December 31, 2007, we had three OLB machines. The machines include multi-pinned tape carrier packaged large scale integrated circuit, or TCP LSIC, bonding which is up to 280 pins, which also provide ultra thin assembly with module thickness to around one millimeter and high accuracy bonding with pin pitch to 100 micrometers. The total production capacity is 12,000 units per month.

TAPE AUTOMATED BONDING WITH ANISOTROPIC CONDUCTIVE FILM, OR TAB WITH ACF, is an advanced heat sealing technology that connects a liquid crystal display component with an integrated circuit in very small LCD modules, such as those used in cellular phones and pagers. As of December 31, 2007, we had 24 systems of TAB with ACF machines. The machines provide process time of 10 to 25 seconds per component, a pin pitch fine to 150 micrometers and a total production capacity of up to 4,936,000 components per month. During 2005, Jetup also started manufacturing TAB LCD modules. As of December 31, 2007, Jetup had four TAB lines and is capable of bonding 2,000,000 pieces of TAB LCD modules a month. They are able to bond LCD panels up to sizes of 120 millimeters x 120 millimeters x 2.2 millimeters thick, with an accuracy of 10 microns’ tolerance in a cycle time of 20-25 seconds per piece.

FINE PITCH HEAT SEAL TECHNOLOGY, OR FPHS TECHNOLOGY, allows us to connect LCD displays to PCBs produced by COB and outer lead bonding that enables very thin connections. This method is highly specialized and is used in the production of finished products such as PDAs. As of December 31, 2007, we had eight machines utilizing FPHS technology. The machines provide a pin pitch fine to 260 micrometers and a total production capacity of up to 268,000 units per month.

SURFACE MOUNT TECHNOLOGY, OR SMT, is a process by which electronic components are mounted directly on both sides of a printed circuit board, increasing board capacity, facilitating product miniaturization and enabling advanced automation of production. We use SMT for products such as electronic linguistic devices. As of December 31, 2007, we had 37 SMT productions lines. The production time per chip ranges from 0.055 second per chip to 0.8 second per chip and high precision ranging from +/-0.05 millimeter to +/-0.1 millimeter. The components size ranges from 0.4 millimeter (length) x 0.2 millimeter (width) to 55 millimeters (length) x 55 millimeters (width). Ball grid array, or BGA, ball pitch is 0.4 millimeter and ball diameter is 0.2 millimeter. Flip Chip, our smallest lead/bump pitch, is 250/240UM and out smallest components spacing is 0.15 micrometers. The total production capacity is over 1 billion resistor capacitor chips per month.

SUPER-TWISTED NEMATIC LCDS, OR STN DISPLAYS, is a type of monochrome passive matrix LCD capable of providing higher information content display systems and are typically found in applications such as cordless phones, mobile phones, MP3 players, pocket games and PDAs. Our Jetup began producing STN LCDs in 2002. During 2005, Jetup upgraded its two existing twisted nematic, or TN type, LCD lines to STN LCD lines. TN displays rotate the director of the liquid crystal by 90°, but STN LCD displays employ up to a 270° rotation. This extra rotation gives the crystal a much steeper voltage-brightness response curve and also widens the agnle at which the display can be viewed before losing much contrast. As of December 31 2007, Jetup was using three automated STN lines capable of producing both TN and STN type LCDs with capacity of 150,000 pairs of glass (each sheet of glass of 360 millimeters x 400 millimeters size) panels per month.

LCD BACK-END is a main manufacturing process for LCD panels, and is regarded as part of the process for its finished product LCD modules. It includes the precise pure water cleaning process, scribing of LCD glass, liquid crystal insertion, sealing process and breaking process, then turns the LCD mother glass into LCD panels. Our machines can cope with 0.2 millimeters + 0.2 millimeters LCD mother glass up to dimension 550 millimeters x 670 millimeters, with cutting tolerance +/-0.1 millimeters. Nam Tai started mass production from September 2006, with monthly maximum production capacity of 1,800,000 units.

As of December 31, 2007, we had eight clean rooms at our principal manufacturing facilities, which housed COB, COF and COG and Chip Scale Package capabilities for CMOS sensor modules, electronic calculators, digital camera accessories, LCD modules manufacturing. At the same date, we also have four clean rooms at another of our factories, which we use to manufacture LCD panels and modules.

A cleanroom is an environment, typically used in manufacturing or scientific research, which has a low level of environmental pollutants such as dust, airborne microbes, aerosol particles and chemical vapors. In other words, a cleanroom has a controlled level of contamination that is specified by the number of particles per cubic meter at a specified particle size. Of our 12 clean rooms at December 31, 2007, four were class ten thousand, six were class thousand and two were class one hundred with one of them use for cleaning the clothes to be used in clean room.

Our properties are located in China: in Shenzhen, 30 miles from Hong Kong, and Wuxi, 60 miles from Shanghai.

The Shenzhen property is in Bao’An District, situated just 6 miles from the International Airport, China’s 3rd largest, and 10 miles from the Qianhai Bay Economic Zone, an exciting new joint venture between the Hong Kong and Shenzhen Governments to attract foreign direct investment.

The Wuxi property is located strategically in Wuxi New District, a major high-tech industrial zone, and within 7 miles of Wuxi’s Airport. Excellent infrastructure enables the Wuxi property to connect seamlessly with the key transportation hub of Shanghai.



Our principal property is located in the Bao’An District of Shenzhen. In December 1993, we acquired a 50-year lease for the land. The major project in Shenzhen is the redevelopment of the Company’s raw land in Guangming Hi-Tech Industrial Park, approximately 30 minutes from Nam Tai’s existing property in Shenzhen and approximately one hour driving distance from Hong Kong. We acquired the land use rights to approximately 1.3 million square feet of land in 2005. In light of the announcement by the Shenzhen government of a City Rezoning Project to redevelop the entire area containing the Company’s existing Shenzhen property into a High-end Commercial district, we are focusing our efforts on redevelopment of the land at the earliest practical time.



The Wuxi site is located on a parcel of approximately 470,000 square feet of land.

When we acquired the land use rights in Wuxi, we also acquired similar rights to a second parcel of approximately 515,000 square feet of raw land situated approximately three miles from the first parcel. In September 2010, we sold the second Wuxi parcel back to the Wuxi local government for approximately $1.6 million, realizing a gain of approximately $0.8 million on the second parcel.

The Wuxi project involves our acquisition of the land use rights to raw land adjacent to our parcel of land in Wuxi. On July 2, 2012 we announced that we recently entered into an agreement with the local government of Wuxi to a purchase of a parcel of land or approximately 470,000 square feet.



As a responsible and forward-looking corporation, Nam Tai appreciates the importance of environmental protection and environmental health and safety.


An appreciation of high levels of environmental, health and safety make sound commercial sense, helping us to reduce development costs and stay ahead of evolving environmental legislation in China and customer markets.

Key Environmental Issues

For our business, we need to ensure that:
  • Properties meet specifications on banned and restricted chemical substances and on design for reuse / recycling;
  • Resources, including electricity and water, are used as efficiently as possible;
  • We comply with local, regional, national and international legislation.